全新狹縫式塗佈頭製程技術之開發及其於積層陶瓷電容之應用

Abstract

狹縫式塗佈技術在工業界受到大量重視，由於此技術具有製程速度快、可以捲對捲(roll to roll)方式連續生產大面積塗膜與塗膜均勻性佳等優點，近年來被大量應用在半導體、平面顯示器與印刷電路板產業。 然而因傳統之狹縫式塗佈模組加工極為耗時與高成本，塗佈模組的最佳化設計常受到傳統機械加工的限制。本研究則利用微機電製程對具有高平整度之矽晶圓作加工，藉由不同的光罩圖案即可自由改變流道設計，並可將塗佈模組輕量化，此方法在狹縫式塗佈模組之開發尚未被探討及應用，因此具有新穎性。 為了驗證本實驗室所開發之毛細管塗佈技術與新式狹縫式塗佈技術在工業界應用的可行性，本研究實際將上述塗佈技術應用於膽固醇液晶顯示器與薄層化積層陶瓷電容(MLCC)的製作。在薄層化積層陶瓷電容塗佈中，吾人自行調配高固含量且低黏度之水性鈦酸鋇漿料，並以實驗定義其流量(G)-塗佈速度(V)之塗佈視窗，搭配毛細管塗佈鎳電極之技術，證實可成功塗佈出介電層厚度t=5.1μm與t=2.8μm具有五層結構之X7R MLCC，並觀察其燒結微結構與致密性，以及量測電容值與介電損失。

Slot die coating technology becomes more and more important for industries, due to the advantages of low time consuming, roll to roll process and high uniformity of coating film. In recent years, slot die coating technology has been applied in many fields, such as semiconductor, flat panel display and printed circuit board, and so on. However, the traditional manufacture process has some limitations which make the optimization of coating die more difficult and complex, such as time consuming and high cost. The purpose of this research was to develop a novel fabrication of coating die by micro electromechanical system (MEMS) process, which can make slot die coater lighter and increase the flexibility of coating die design. Capillary coating technology and novel slot coating technology were conducted in the application of Cholesteric Liquid Crystal Display display (ChLC) and Multilayer capacitor(MLCC). 5 layers X7R MLCC with dielectric layer 5.1 μm and 2.8μm were demonstrated by the combination of these two coating technologies. The microstructure and electrical properties of MLCC were investigated in this article.