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標題: | 變壓器與系統構裝應用於微波與毫米波電路 Transformer and System in Package for RF and Millimeter-wave Circuit Applications |
作者: | Che-Chung Kuo 郭哲均 |
指導教授: | 王暉(Huei Wang) |
關鍵字: | 混波器,功率放大器,平衡對不平衡轉換器,覆晶封裝,相位陣列,天線, mixers,power amplifiers,balun,flip-chip package,phased-array antenna,antenna., |
出版年 : | 2012 |
學位: | 博士 |
摘要: | 隨著無線通訊高度發展,積體化的電路對於晶片面積的需求度越趨嚴格,對於電路設計者,總是要在相同的電路特性下,挑戰最小的電路面積,這個也是電路設計者長久以來所追求的系統晶片(System on Chip, SoC) 概念。再者,系統構裝(System-in-Package, SiP)的概念,在這幾年中已經萌芽生長,系統構裝的精隨著重於特性分工,不適應用於晶片設計上的電路,將可以利用系統構裝的概念,來達到更高整合度。無論在電路特性最佳化,或是成本的考量都是系統構裝最大的優點。在此篇論文中,我們分別從系統晶片與系統構裝的角度,來探討電路設計與系統研發。本論文是國內第一篇使用封裝的角度來設計毫米波電路與系統整合的論文,並使用許多不同的封裝技術方法實現。
論文的第一部分晶片變壓器實現於混波器以及功率放大器。我們將晶片變壓器應於到射頻混頻器當中,與發展了馬遜雙巴倫(Marchand Dual Balun)。並且利用此馬遜雙巴倫做佈局方面的改變,進一步發明了改良式鼠競一百八十度混成器(Modified Rat Race 180° Hybrid)。在此論文中,我們展示了三個星狀混波器(Star Mixer),搭配了三種不同的馬遜雙巴倫佈局。馬遜雙巴倫的應用還可以用在一個新的雙平衡電阻性次諧波混波器上,此新架構不但可以保有原來的混頻器功能,而且改善了兩倍本地振盪訊號隔離度。我們也實現了在互補式金氧半導體的24-GHz全變壓器式功率放大器,利用變壓器的設計佈局,使其特性在所有的文獻中達到最高的功率面積比。 在此論文的第二個部份,是使用系統封裝的概念,來研發多晶片模組(Multi-Chip Module, MCM)毫米波的系統。我們以低溫共燒陶瓷(Low Temperature Co-fired Ceramic, LTCC)為作為載板(Carrier)來實現了一個V頻段巴特勒矩陣(Butler Matrix)切換式波束(Switched Beam)相位陣列發射器。此發射器整合了十多個互補式金氧半毫米波晶片,包含了振盪器,本地振盪緩衝放大器,功率放大器,相移器等。我們更實現了一個新型的立體式摺疊型單極化天線(Vertical Folded Monopole Antenna)。此發射器不但是第一個利用金氧半導體多晶片模組封裝的概念實現的V頻段發射器,也第一個使用端火(End-fire)輻射方向的發射器。 在更高頻的應用中,我們實現了W頻段金氧半導體晶片的多晶片模組封裝,在這個頻段下,覆晶柱體(Flip Chip Bump)的一些寄生效應已經相當明顯。經由簡單的公式估算下,我們可以得知整個轉接呈現了電容性的特性,所以高阻抗(電感)的補償電路就可將返回損耗的頻率漂移補償。三個W頻段的電路分別有裸晶,無補償,以及補償電路的比較。因切割(Dicing)的不準確性,而導致了等校電路中的寄生電容造成變化,所以我們也分析了改善的等效電路並以三個金氧半電路驗證。最後,本論文也採用一個陶瓷基板平面式的八木(YagiUda)天線並且展示一組簡單的W頻段的發射器與接收器。 With the development of wireless communications, the miniature chip area of integrated circuit chip becomes more valuable, and the circuit designers always try to challenge the smallest circuit area with the same circuit characteristics. This is the reason that system on chip (SoC) concept was proposed. Furthermore, the concept of system in package (SiP) was bought up in the past few years. The essence of the SiP is chip heterogeneous processes integration. For the circuits which are not suited to be designed on chip, it will be able to use the concept of system packaging to achieve higher level integration for the circuit characteristics and cost considerations. In the first part of dissertation, we propose miniaturization Marchand dual balun and modified rat race 180° hybrid. Three different types of star mixers are demonstrated with different dual balun. Furthermore, a new sub-harmonic mixer topology with dual blaun is proposed. This new mixer structure will not only be able to keep the original function of the mixer, but also to improve the isolation of twice LO signal. The transformer can be used for amplifier design. A 24-GHz CMOS transformer combined power amplifier is also demonstrated, which achieves the highest power to area ratio compared with all published literature. The concept of using the system package is used to develop multi-chip module (MCM) millimeter-wave system in the second part of this dissertation. A V-band Butler matrix switched beam phased-array transmitter is demonstrated. Furthermore, a new type of vertical folding type monopole antenna is proposed. This transmitter is the first MCM packaging concept demonstration in the V-band application, and the first V-band phased array with end-fire radiation direction. Regarding the higher frequency as W band, the parasitic of the flip chip bump has a significant performance effect; therefore the bump equivalent circuit is studied for W band application. Besides, the compensation of flip chip transition is also discussion. We present a W-band CMOS MCM including two amplifiers and a down converted mixer. The entire transition of the flip chip shows capacitive characteristics, so the compensation circuit of the high-impedance (inductance) is used for return loss compensation. Three W-band circuit dies are measured via wafer probing without compensation, and with compensation network. Unfortunately, the parasitic capacitor in bump equivalent circuit is sensitive in such high frequency due to the inaccuracy of dicing. Therefore, we also analyze equivalent circuit with the dicing tolerance. The new circuit model is also verified by three CMOS circuits. Finally, the W-band transmitter and receiver antenna also demonstrated with Yagi-Uda antenna on ceramic. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/15876 |
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顯示於系所單位: | 電信工程學研究所 |
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