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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 莊東漢(Tung-Han Chuang) | |
dc.contributor.author | Chung-Lin Yang | en |
dc.contributor.author | 楊忠霖 | zh_TW |
dc.date.accessioned | 2021-06-07T17:49:39Z | - |
dc.date.copyright | 2013-02-16 | |
dc.date.issued | 2013 | |
dc.date.submitted | 2013-01-30 | |
dc.identifier.citation | 1. M. Zhou, J.F. Li, Takuji Kita, 'Nanostructured AgPbmSbTem+2 System Bulk Materials with Enhanced Thermoelectric Performance.', Journal of American chemical society, Vol. 130, 2008, p.4527–4532.
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dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/15664 | - |
dc.description.abstract | 熱電材料是近年來興起的一種綠色能源,能將熱能與電能互相轉換,傳統熱電材料與電極間的接合方式以軟銲或硬焊為主,由於熱電材料在高溫下操作,因此軟銲及硬焊皆有其不適用的地方,為了克服傳統接合的缺失,本研究使用低熔點金屬薄膜Sn以及In,Ag為高熔點金屬以固液擴散接合的方式將熱電材料與Cu電極接合,所選用的熱電材料為低溫熱電材料Bi0.5Sb1.5Te3及中溫熱電材料GeTe(Pb),各接合條件下的界面微結構分析、介金屬動力學分析、接合強度測試、以及破斷面分析,最後還有電阻量測都將被探討。
實驗結果顯示,經過固液擴散接合之接點已全部反應成高熔點之介金屬,Ag/Sn/Ag接點生成Ag3Sn介金屬,其熔點可達480℃,時效至275℃時間1000小時Ag3Sn已轉成熔點更高的介金屬Ag5Sn (724℃),而Ag/In/Ag接點則生成熔點為660℃以上的Ag9In4介金屬,可滿足日後熱電材料在高溫環境下使用接點熔化的問題,因此達到固液擴散接合「低溫接合,高溫使用」的目的。除此之外,本研究以預鍍Sn製程增強Ni層與熱電材料間的鍵結力,以及增加接合壓力這兩種方式大幅提高了接合強度及穩定性,斷面顯示都在預鍍Sn擴散層端甚至深達熱電材料內部。接合後的試片進行電阻量測,發現各系統接合界面接觸電阻率占整體電阻率3%左右,對於日後熱電模組效率影響甚小,藉由接合界面接觸電阻率也可知道經過固液擴散接合後各系統的接合品質良好。 | zh_TW |
dc.description.abstract | Thermoelectric materials have gained attention in recent years for use in green energy applications that involve the exchange of heat energy and electrical energy. Traditionally, soldering or brazing methods are employed for the bonding of thermoelectric materials with electrodes. However, because thermoelectric materials operate at high temperature, soldering and brazing methods are not applicable. In order to overcome the shortcomings of traditional bonding methods, researchers have developed a novel bonding technique called solid-liquid interdiffusion bonding (SLID). This study employs Sn or In as a low-melting point metallic thin-film interlayer and Ag as a high-melting point metallic via SLID method to bond thermoelectric materials and Cu electrode. Bi0.5Sb1.5Te3 and GeTe(Pb) thermoelectric materials are employed as the low-temperature thermoelectric material and middle-temperature thermoelectric material, respectively. The morphology of the intermetallic compounds that formed at the interfaces after various SLID conditions were observed and their chemical compositions were analyzed. In addition, the shear strengths during SLID of the TE modules were measured to evaluate the bonding ability of the specimens, and the electrical resistance was also analyzed.
Experimental results indicated that the Ag/Sn/Ag or Ag/In/Ag joints formed high melting point intermetallic compounds. The melting point of Ag3Sn intermetallic compound is 480oC; Ag3Sn transforms to a higher melting point (724oC) Ag5Sn phase after aging at 275oC for 1000 hrs; and the Ag/In/Ag joint formed intermetallic compound Ag9In4, which has a melting point of 660oC. This approach fully achieved bonding at low temperature and application at high temperature. In addition, a Sn pre-coating process was used to enhance the bonding force between thermoelectric materials and Ni, and the bonding strengths were increased by increasing the bonding pressure. Shear strength tests indicated that the fracture face occurred at the pre-coating Sn alloy or thermoelectric materials matrix. The electrical contact resistivity of the bonding interface was less than 3% of the total electrical resistivity. This small proportion implies that the bonding performance is quite good during SLID. | en |
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dc.description.tableofcontents | 摘要..............................................................................................................................Ⅰ
目錄..............................................................................................................................Ⅳ 圖目錄..........................................................................................................................Ⅶ 表目錄......................................................................................................................ⅩⅤ 壹. 前言.......................................................................................................................1 貳. 理論及文獻回顧..................................................................................................9 2.1常見之材料接合製程..............................................................................................9 2.1.1 軟銲(Soldering)............................................................................................9 2.1.2 硬銲(Brazing).............................................................................................10 2.1.3 固液擴散接合(Solid-Liquid Interdiffusion Bonding,SLID)............11 2.2 界面成長動力學分析...........................................................................................13 2.2.1 擴散控制反應............................................................................................14 2.2.2 界面控制反應............................................................................................15 2.3 文獻回顧...............................................................................................................16 2.3.1熱電材料與電極接合應用.........................................................................16 2.3.2固液擴散接合(SLID)之界面反應............................................................18 2.3.3 Cu/Sn界面反應..........................................................................................22 2.3.4 Ag/Sn界面反應..........................................................................................25 2.3.5 Ni/Sn界面反應...........................................................................................26 2.3.6 Sn/Te界面反應...........................................................................................28 參. 實驗方法............................................................................................................40 3.1 Bi0.5Sb1.5Te3或GeTe(Pb)與Cu電極接合製程....................................................40 3.2 Bi0.5Sb1.5Te3或GeTe(Pb)與Cu電極接合後之電阻量測......................................42 肆. 實驗結果與討論.................................................................................................54 4.1 低溫熱電材料Bi0.5Sb1.5Te3與Sn系統接合.........................................................54 4.1.1 Bi0.5Sb1.5Te3/Ni/Ag—Sn/Ag/Cu之界面反應.............................................54 4.1.2 Bi0.5Sb1.5Te3/Ni/Ag—SnAg/Cu之接合強度測試......................................55 4.1.3 Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu之界面反應........................................56 4.1.4 Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu接合界面介金屬成長動力學...........58 4.1.5 Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu預鍍Sn擴散層成長動力學.............60 4.1.6 Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu之接合強度測試...............................61 4.1.7 Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu之加壓接合界面反應與強度測試...64 4.1.8 Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu時效275℃、1000小時...................66 4.2 中溫熱電材料GeTe(Pb) 與Sn系統接合..........................................................68 4.2.1 GeTe(Pb)/Ni—Sn/Ag/Cu之界面反應.......................................................68 4.2.2 GeTe(Pb)/Ni—Sn/Ag/Cu之接合強度測試...............................................68 4.2.3 GeTe(Pb)/Sn/Ni—Sn/Ag/Cu之界面反應..................................................69 4.2.4 GeTe(Pb)/Sn/Ni—Sn/Ag/Cu接合界面介金屬成長動力學......................71 4.2.5 GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu預鍍Sn擴散層成長動力學..................71 4.2.6 GeTe(Pb)/Sn/Ni—Sn/Ag/Cu之接合強度測試..........................................72 4.2.7 GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu之加壓接合界面反應與強度測試........73 4-3低溫熱電材料Bi0.5Sb1.5Te3與In系統之接合....................................................76 4-3.1 Bi0.5Sb1.5Te3/Ni/Ag—In/Ag/Cu之界面反應.............................................76 4-3.2 Bi0.5Sb1.5Te3/Ni/Ag—In/Ag/Cu之接合強度測試.....................................77 4-3.3 Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu之界面反應........................................78 4-3.4 Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu接合界面介金屬成長動力學............79 4-3.5 Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu之接合強度測試................................81 4-3.6 Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu之加壓接合界面反應及強度測試....82 4.3.7 Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu時效250℃、100小時、500小時.....83 4-4中溫熱電材料GeTe(Pb)與In系統之接合............................................................85 4-4.1 GeTe(Pb)/Ni/Ag—In/Ag/Cu之界面反應..................................................85 4-4.2 GeTe(Pb)/Ni/Ag—In/Ag/Cu之接合強度測試..........................................85 4-4.3 GeTe(Pb)/Sn/Ni/Ag—In/Ag/Cu之界面反應.............................................86 4-4.4 GeTe(Pb)/Sn/Ni/Ag—In/Ag/Cu之接合界面介金屬成長動力學.............87 4-4.5 GeTe(Pb)/Sn/Ni/Ag—In/Ag/Cu之接合強度測試.....................................88 4-4.6 GeTe(Pb)/Sn/Ni/Ag—In/Ag/Cu之加壓接合界面反應及強度測試.........89 伍. 電阻量測 5-1 電阻量測.............................................................................................................167 5-1.1 預鍍Sn製程對熱電材料Bi0.5Sb1.5Te3電性之影響..............................167 5-1.2 Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu之電性研究......................................168 5-1.3 Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu之電性研究......................................169 5-2 預鍍Sn製程對熱電材料GeTe(Pb)電性之影響...............................................170 5-2.1 GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu之電性研究..........................................170 5-2.2 GeTe(Pb)/Sn/Ni/Ag—In/Ag/Cu之電性研究...........................................171 陸. 結 論...................................................................................................................177 柒. 參考文獻...........................................................................................................181 圖目錄 圖1-1:Seebeck effect (1823)示意圖[101]....................................................................6 圖1-2:Peltier effect (1835)示意圖[101].......................................................................6 圖1-3:Thomson effect (1851)示意圖[101].................................................................6 圖1-4:以P型及N型半導體互相搭配之熱電元件示意圖[25]................................7 圖1-5:常見熱電材料ZT值與溫度變化之關係圖[19]..............................................8 圖2-1:圖2-1:固液擴散接合(SLID)示意圖...............................................................31 圖2-2:Cu-Sn相平衡圖[97].........................................................................................32 圖2-3:Au-In相平衡圖[97].........................................................................................32 圖2-4:Au/Cu/Al2O3/Sn/In/Cu/Ti/Si系統之界面反應及其強度測試[31].................33 圖2-5:Ag-In相平衡圖[97].........................................................................................34 圖2-6:Al-Ni相平衡圖[97].........................................................................................34 圖2-7:Ni-Sn相平衡圖[97]........................................................................................35 圖2-8:Ag-Sn相平衡圖[97]........................................................................................35 圖2-9:Cu/Sn/Cu系統 (a)不同時間下介金屬生長情形,(b)破斷面在介金屬 Cu6Sn5[41]............................................................................................................36 圖2-10:介金屬Cu3Sn之強度測試[41].....................................................................37 圖2-11:介金屬Cu3Sn內所出現的Kirkendall Void[60]...........................................38 圖2-12:Sn-Te相平衡圖[98].......................................................................................39 圖3-1:研磨拋光機......................................................................................................43 圖3-2:(a)固液擴散真空接合設備,(b)試片加熱載台,(c)加熱溫度控制器.............44 圖3-3:熱電材料與Cu電極接合示意圖....................................................................45 圖3-4:電子顯微鏡SEM及EDX...............................................................................46 圖3-5:Dage 4000慢速推球機....................................................................................46 圖3-6:強度測試示意圖..............................................................................................47 圖3-7:熱電材料與Cu電極接合之實驗流程圖........................................................50 圖3-8:預鍍Sn製程下熱電材料與Cu電極接合示意圖...........................................51 圖3-9:預鍍Sn製程下熱電材料與Cu電極接合之實驗流程圖...............................52 圖3-10:電阻量測之實驗流程圖................................................................................53 圖4-1:Bi0.5Sb1.5Te3/Ni/Ag—Sn/Ag/Cu接合溫度 (a) 250℃時間5分鐘,(b) 300 ℃時間30分鐘.....................................................................................................91 圖4-2:Bi0.5Sb1.5Te3/Ni/Ag—Sn/Ag/Cu系統之接合強度圖....................................92 圖4-3:Bi0.5Sb1.5Te3/Ni/Ag—Sn/Ag/Cu系統之破斷面,(a) Ni/Ag/Sn/Ag/Cu端 (b) Bi0.5Sb1.5Te3端......................................................................................................93 圖4-4:Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu接合溫度250℃時間 (a)5分鐘、(b)10 分鐘、(c)30分鐘、(d)60分鐘................................................................................94 圖4-5:Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu接合溫度250℃時間5分鐘之X-光元素 分析圖..................................................................................................................95 圖4-6:Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu接合溫度250℃時間5分鐘之線掃描分 析圖......................................................................................................................96 圖4-7:Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu接合溫度275℃時間 (a)5分鐘、(b)10 分鐘、(c)30分鐘、(d)60分鐘................................................................................97 圖4-8:Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu接合溫度300℃時間 (a)5分鐘、(b)10 分鐘、(c)30分鐘、(d)60分鐘................................................................................98 圖4-9:Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu接合溫度325℃時間 (a)5分鐘、(b)10 分鐘、(c)30分鐘、(d)60分鐘................................................................................99 圖4-10:Bi0.5Sb1.5Te3/Sn預熱製程 (a)預熱前、(b)預熱後.......................................100 圖4-11:介金屬Ag3Sn厚度X對時間t之關係圖.....................................................103 圖4-12:介金屬Cu3Sn厚度log(X)對時間log(t)之關係圖......................................104 圖4-13:介金屬Cu3Sn厚度X對時間t1/2之關係圖..................................................104 圖4-14:介金屬Cu6Sn5+Cu3Sn厚度log(X)對時間log(t)之關係圖.........................105 圖4-15:Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu系統下介金屬Cu3Sn之活化能..........105 圖4-16:Te-Sb-Bi厚度log(X)對時間log(t)之關係圖..............................................106 圖4-17:Te-Sb-Bi厚度X對時間t1/2之關係圖..........................................................106 圖4-18:Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu系統下Te-Sb-Bi之活化能..................107 圖4-19:SnTe+(Bi,Ni)厚度log(X)對時間log(t)之關係圖........................................107 圖4-20:Bi0.5Sb1.5Te3/SnNi/Ag—Sn/Ag/Cu之接合強度圖......................................108 圖4-21:Bi0.5Sb1.5Te3/SnNi/Ag—Sn/Ag/Cu系統之破斷面,(a)接合溫度250℃時間 5分鐘、(b)接合溫度250℃時間60分鐘、(c)接合溫度325℃時間60分鐘、 (d)接合溫度300℃時間30分鐘........................................................................109 圖4-22:Ni-Sb相平衡圖[82]......................................................................................110 圖4-23:dimple狀破斷形成示意圖..........................................................................111 圖4-24:扇貝狀Ag3Sn接合界面孔洞形成示意圖.................................................112 圖4-25:Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu接合壓力9.8 MPa,(a) 250℃時間5分 鐘、(b) 250℃時間10分鐘、(c) 275℃時間5分鐘、(d) 250℃時間60分鐘......113 圖4-26:圖4-26:接合壓力9.8 MPa與接合壓力3 MPa之 Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu系統強度測試,(a)250℃,(b)275℃..........114 圖4-27:接合壓力9.8 MPa之Bi0.5Sb1.5Te3/SnNi/Ag—Sn/Ag/Cu系統破斷面,(a) 接合溫度275℃時間5分鐘、(b)接合溫度250℃時間5分鐘、(c)接合溫度275 ℃時間10分鐘、(d)接合溫度275℃時間60分鐘.............................................115 圖4-28:接和壓力9.8 MPa之Bi0.5Sb1.5Te3/SnNi/Ag—Sn/Ag/Cu系統加熱強度測 試........................................................................................................................116 圖4-29:接和壓力9.8 MPa之Bi0.5Sb1.5Te3/SnNi/Ag—Sn/Ag/Cu系統破斷面,(a) 測試溫度150℃時間5分鐘、(b)測試溫度200℃時間30分鐘........................116 圖4-30:Bi0.5Sb1.5Te3/SnNi/Ag—Sn/Ag/Cu溫度275℃時效1000小時之金相圖...117 圖4-31:Bi0.5Sb1.5Te3/SnNi/Ag—Sn/Ag/Cu溫度275℃時效1000小時之破斷面...117 圖4-32:GeTe(Pb)/Ni/Ag—Sn/Ag/Cu (a)接合溫度250℃時間30分鐘、(b)接合溫 度300℃時間30分鐘.........................................................................................118 圖4-33:GeTe(Pb)/Ni/Ag—Sn/Ag/Cu系統之接合強度圖.......................................119 圖4-34:GeTe(Pb)/Ni/Ag—Sn/Ag/Cu系統之破斷面...............................................119 圖4-35:GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu接合溫度250℃時間 (a)5分鐘、(b)10分 鐘、(c)30分鐘、(d)60分鐘..................................................................................120 圖4-36:GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu接合溫度275℃時間 (a)5分鐘、(b)10分 鐘、(c)30分鐘、(d)60分鐘..................................................................................121 圖4-37:GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu接合溫度300℃時間 (a)5分鐘、(b)10分 鐘、(c)30分鐘、(d)60分鐘..................................................................................122 圖4-38:GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu接合溫度325℃時間 (a)5分鐘、(b)10分 鐘、(c)30分鐘、(d)60分鐘..................................................................................123 圖4-39:GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu接合溫度275℃時間30分鐘之預鍍Sn 擴散層局部放大圖............................................................................................125 圖4-40:GeTe(Pb)/Sn預熱溫度250℃時間3分鐘..................................................126 圖4-41:GeTe(Pb)/Sn預熱溫度250℃時間3分鐘 (a)表面形貌、(b)橫截面..........127 圖4-42:介金屬Ag3Sn厚度(X)與時間(t)之關係圖.................................................128 圖4-43:介金屬Cu3Sn厚度log(X)對時間log(t)之關係圖......................................129 圖4-44:介金屬Cu3Sn厚度X對時間t1/2之關係圖..................................................129 圖4-45:GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu系統下介金屬Cu3Sn之活化能..............130 圖4-46:介金屬(Ni,Ge)3Sn4厚度log(X)對時間log(t)之關係圖..............................130 圖4-47:GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu系統之破斷面,(a)(b)強度值較高時、(c)(d) 強度值較低時....................................................................................................132 圖4-48:GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu接合壓力9.8 MPa,(a) 250℃時間5分鐘、 (b) 250℃時間10分鐘、(c)300℃時間5分鐘、(d) 300℃時間60分鐘.............133 圖4-49:接合壓力9.8 MPa與接合壓力3 MPa之GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu 系統強度測試,(a)250℃,(b)300℃...................................................................134 圖4-50:接和壓力9.8 MPa之GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu系統破斷面,(a)溫 度300℃時間5分鐘、(b)溫度250℃時間10分鐘、(c)溫度300℃時間60分 鐘........................................................................................................................135 圖4-51:接合壓力9.8 MPa之GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu系統加熱強度測試 ............................................................................................................................136 圖4-52:接和壓力9.8 MPa之GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu系統破斷面,(a)測 試溫度350℃時間0分鐘、(b)測試溫度350℃時間5分鐘、(c)測試溫度400 ℃時間5分鐘、(d)測試溫度400℃時間30分鐘...............................................136 圖4-53 : MIL-STD-883G Die shear strength規範....................................................137 圖4-54:Bi0.5Sb1.5Te3/Ni/Ag—In/Ag/Cu接合溫度 (a) 175℃時間5分鐘,(b) 225 ℃時間30分鐘...................................................................................................138 圖4-55:Cu-In相平衡圖[83]......................................................................................139 圖4-56:Bi0.5Sb1.5Te3/Ni/Ag—In/Ag/Cu系統強度測試...........................................140 圖4-57:Bi0.5Sb1.5Te3/Ni/Ag—In/Ag/Cu系統之破斷面,(a) Ni/Ag/Sn/Ag/Cu端 (b) Bi0.5Sb1.5Te3端....................................................................................................140 圖4-58:Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu接合溫度175℃時間 (a)5分鐘、(b)10 分鐘、(c)30分鐘、(d)60分鐘..............................................................................141 圖4-59:Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu接合溫度200℃時間 (a)5分鐘、(b)10 分鐘、(c)30分鐘、(d)60分鐘..............................................................................142 圖4-60:Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu接合溫度225℃時間 (a)5分鐘、(b)10 分鐘、(c)30分鐘、(d)60分鐘..............................................................................143 圖4-61:Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu接合溫度250℃時間 (a)5分鐘、(b)10 分鐘、(c)30分鐘、(d)60分鐘..............................................................................144 圖4-62:Ag-In介金屬厚度X對時間t之關係圖......................................................145 圖4-63:Ag-In介金屬厚度log(X)對時間log(t)之關係圖.......................................145 圖4-64:扇貝狀γ-Ag2In接合界面孔洞形成示意圖................................................146 圖4-65:Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu之接合強度圖......................................147 圖4-66:Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu系統之破斷面,(a)(b)強度值介於7 MPa~8 MPa左右、(c)(d)強度值超過8.5 MPa時.............................................148 圖4-67:Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu接合壓力9.8 MPa,(a) 175℃時間5分 鐘、(b) 200℃時間5分鐘、(c)200℃時間10分鐘、(d) 175℃時間60分鐘.......149 圖4-68:接合壓力9.8 MPa與接合壓力3 MPa之 Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu系統強度測試,(a)175℃,(b)225℃...........150 圖4-69:接和壓力9.8 MPa之Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu系統破斷面,(a) 溫度175℃時間10分鐘、(b)溫度175℃時間60分鐘......................................151 圖4-70:接和壓力9.8 MPa之Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu系統加熱強度測 試........................................................................................................................152 圖4-71:接和壓力9.8 MPa之Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu系統破斷面,(a) 測試溫度175℃時間5分鐘、(b)測試溫度200℃時間30分鐘........................152 圖4-72 : Bi0.5Sb1.5Te3/SnNi/Ag—In/Ag/Cu溫度250℃(a)時效100小時之金相圖, (b)時效500小時之金相圖、(c)時效500小時之Sb原素分佈圖、(d) 時效500 小時之Bi原素分佈圖.......................................................................................153 圖4-73 : Bi0.5Sb1.5Te3/SnNi/Ag—In/Ag/Cu溫度250℃ (a)時效100小時,(b)時效 500小時之破斷面.............................................................................................154 圖4-74:GeTe(Pb)/Ni/Ag—In/Ag/Cu接合溫度 (a) 175℃時間5分鐘,(b) 225℃時 間30分鐘...........................................................................................................155 圖4-75:GeTe(Pb)/Ni/Ag—In/Ag/Cu系統之強度測試............................................156 圖4-76:GeTe(Pb)/Ni/Ag—In/Ag/Cu系統之破斷面................................................156 圖4-77:GeTe(Pb)/Ni/Ag—In/Ag/Cu接合溫度175℃時間 (a)5分鐘、(b)10分鐘、 (c)30分鐘、(d)60鐘............................................................................................157 圖4-78:GeTe(Pb)/Ni/Ag—In/Ag/Cu接合溫度200℃時間 (a)5分鐘、(b)10分鐘、 (c)30分鐘、(d)60分鐘........................................................................................158 圖4-79:GeTe(Pb)/Ni/Ag—In/Ag/Cu接合溫度225℃時間 (a)5分鐘、(b)10分鐘、 (c)30分鐘、(d)60分鐘........................................................................................159 圖4-80:GeTe(Pb)/Ni/Ag—In/Ag/Cu接合溫度250℃時間 (a)5分鐘、(b)10分鐘、 (c)30分鐘、(d)60分鐘........................................................................................160 圖4-81:Ag-In介金屬厚度X對時間t之關係圖......................................................161 圖4-82:Ag-In介金屬厚度log(X)對時間log(t)之關係圖.......................................161 圖4-83:GeTe(Pb)/Ni/Ag—In/Ag/Cu系統之接合強度測試....................................162 圖4-84:GeTe(Pb)/Ni/Ag—In/Ag/Cu系統之破斷面,(a)(b)Ag-In接合界面,(c)(d) 預鍍Sn擴散層...................................................................................................162 圖4-85:GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu接合壓力9.8 MPa,(a)175℃時間5分鐘、 (b)170℃時間10分鐘、(c)225℃時間5分鐘(d) 225℃時間60分鐘................163 圖4-86:接合壓力9.8 MPa與接合壓力3 MPa之GeTe(Pb)/Sn/Ni/Ag—In/Ag/Cu 系統強度測試,(a) 175℃,(b)225℃..................................................................164 圖4-87:接和壓力9.8 MPa之GeTe(Pb)/Sn/Ni/Ag—In/Ag/Cu系統破斷面,(a)測 試溫度175℃時間5分鐘、(b)測試溫度225℃時間10分鐘............................165 圖4-88:接合壓力9.8 MPa之GeTe(Pb)/Sn/Ni/Ag—In/Ag/Cu系統加熱強度測試 ............................................................................................................................166 圖4-89:接和壓力9.8 MPa之GeTe(Pb)/Sn/Ni/Ag—In/Ag/Cu系統破斷面,(a) 測試溫度350℃時間0分鐘、(b)測試溫度350℃時間5分鐘、(c)測試溫度400 ℃時間5分鐘、(d)測試溫度400℃時間30分鐘...............................................166 圖5-1:Bi0.5Sb1.5Te3經預鍍Sn預熱後橫截面圖.....................................................173 圖5-2:外插法量測Sn擴散層之電阻示意圖...........................................................173 圖5-3:外插法量測Bi0.5Sb1.5Te3之預鍍Sn擴散層電阻值......................................174 圖5-4:外插法量測Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu接合區之電阻值...............174 圖5-5:外插法量測Bi0.5Sb1.5Te3/Sn/Ni/Ag—In/Ag/Cu接合區之電阻值................175 圖5-6:外插法量測GeTe(Pb)之預鍍Sn擴散層電阻值...........................................175 圖5-7:外插法量測GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu接合區之電阻值...................176 圖5-8:外插法量測GeTe(Pb)/Sn/Ni/Ag—In/Ag/Cu接合區之電阻值....................176 表目錄 表2-1:常見無鉛銲錫成份與熔點[96].......................................................................30 表3-1:電鍍Ni鍍液配方及操作條件.........................................................................48 表3-2:電鍍Ag鍍液配方及操作條件........................................................................48 表3-3:電鍍Sn鍍液配方及操作條件.........................................................................49 表3-4:電鍍In鍍液配方及操作條件..........................................................................49 表4-1:Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu在各條件下之介金屬平均生長厚 度........................................................................................................................101 表4-2:Bi0.5Sb1.5Te3/Sn/Ni/Ag—Sn/Ag/Cu在各條件下之預鍍Sn擴散層平均生長 厚度....................................................................................................................102 表4-3:GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu在各條件下之介金屬平均生長厚度........124 表4-4:GeTe(Pb)/Sn/Ni/Ag—Sn/Ag/Cu系統之接合強度值....................................131 | |
dc.language.iso | zh-TW | |
dc.title | 熱電材料與銅電極之固液擴散接合研究 | zh_TW |
dc.title | Thin Film Solid-Liquid Interdifusion Bonding of Thermoelectric Materials with Cu Electrode | en |
dc.type | Thesis | |
dc.date.schoolyear | 101-1 | |
dc.description.degree | 博士 | |
dc.contributor.oralexamcommittee | 黃振東(Jen-Dong Hwang),吳春森(Chun-Sen Wu),謝慧霖(Hui-Lin Hsieh),黃菁儀(Jing-Yi Huang),簡朝棋(Chao-Chi Chien) | |
dc.subject.keyword | 固液擴散接合,熱電材料,界面反應,強度測試,電阻量測, | zh_TW |
dc.subject.keyword | solid-liquid interdiffusion bonding,thermoelectric materials,interface reaction,strengh test,electrical resistance measurement, | en |
dc.relation.page | 193 | |
dc.rights.note | 未授權 | |
dc.date.accepted | 2013-01-30 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
顯示於系所單位: | 材料科學與工程學系 |
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