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標題: | 台灣企業跨國併購之個案研究:以環球晶併購SunEdison Semiconductor為例 A Case Study on the Cross-border Merger and Acquisition of Taiwanese Companies: Globalwafers and SunEdison Semiconductor |
作者: | Ting Yang 楊霆 |
指導教授: | 邱顯比(Shean-Bii Chiu) |
關鍵字: | NULL |
出版年 : | 2020 |
學位: | 碩士 |
摘要: | 2016年12月,環球晶圓股份有限公司(下稱「環球晶圓」)透過百分之百持有之子公司GWafers Singapore Pte Ltd.以現金6.83億美元收購了美國企業SunEdison Semiconductor全部流通在外普通股(包括SunEdison Semiconductor現有淨債務),完成了台灣併購史上少有以小博大的跨國併購成功案例。 本研究採個案研究法,利用過去研究作為分析此次併購案的工具,深入探討環球晶圓收購SunEdison Semiconductor的收購前準備、收購過程、與收購後的整併,嚴謹的整理出與過去研究相吻合的四個關鍵成功因素:(1)長期關注對手與產業狀況、(2)管理團隊豐富的併購經驗、(3)高度互補性的水平併購、以及(4)併購後快速且強硬的整合,最後觀察環球晶圓在收購案後的財務報表得知其收購績效相當良好。 冀求台灣企業日後遇到動盪之國際環境與激烈競爭、必須走向世界跨國發展時,能套用此四個成功關鍵因素作為跨國併購的成功模式,提早做好跨國併購之準備。 In December 2016, Global Wafer Corporation ('Global Wafer'), through its 100% owned subsidiary GWafers Singapore Pte Ltd. acquired all of the outstanding common shares (including SunEdison Semiconductor's existing net debt) of U.S. enterprise SunEdison Semiconductor for US$683 million in cash, completing one of the few successful cross-border M A cases in the history of Taiwan M A. This study adopts a case study approach and uses past research as a tool to analyze this M A case, and thoroughly investigates the pre-acquisition preparation, acquisition process, and post-acquisition consolidation by Global Wafer, and rigorously compiles four key success factors that coincide with past research: (1) long-term focus on conditions of competitors and industry, (2) management team's rich M A experience, (3) highly complementary horizontal M A, and (4) rapid and strong post-acquisition integration. It is hoped that Taiwanese companies will apply these four key success factors as a successful model for cross-border M A in the future and prepare for cross-border M A in advance when they encounter a turbulent international environment and fierce competition. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/15358 |
DOI: | 10.6342/NTU202001166 |
全文授權: | 未授權 |
顯示於系所單位: | 財務金融學系 |
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U0001-2806202000533100.pdf 目前未授權公開取用 | 2.01 MB | Adobe PDF |
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