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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/10645
標題: | 音效薄膜應力釋放結構之分析與評估 Technical Evaluation of Stress Release Structures for MEMS Acoustic Diaphragms |
作者: | Chien-Wei Huang 黃建瑋 |
指導教授: | 傅增棣 |
關鍵字: | 微機電電容式麥克風,殘留應力,CMOS,應力釋放結構,有限元素法, MEMS microphone,Residual stress,CMOS,Stress release structure,FEM, |
出版年 : | 2010 |
學位: | 碩士 |
摘要: | 微機電電容式麥克風之性能會因為製程殘留應力的影響而顯著下降,因此常藉由應力釋放結構來減少薄膜之殘留應力以改善系統性能。本研究以CMOS標準製程為基礎之設計平台,運用大撓曲平板模型,以及等效剛體模型理論所分類之五種應力釋放結構,據以建構薄膜系統之有限元素分析模型,再透過多層平板和波紋結構薄膜理論之驗證,本研究根據所選用之六項綜合性能指標進行評估之後得知,樑支撐結構是五種應力釋放結構中表現最佳者,故針對樑支撐結構之關鍵特性參數來進行電容式麥克風綜合效能之改善。其結果顯示減少結構寬度可以同時提昇系統的機械敏感度和電敏感度;結構長度變動的效果最為敏感,但僅能提升機械敏感度;而改變結構個數會因為應力釋放結構與音效薄膜連接位置之不同而有不同的趨勢,並據此提出應力釋放結構較佳的設計程序。 Residual stress generated by the manufacturing process of MEMS microphones significantly deteriorates system performance. As a result, it is normal to use stress release structure (SRS) to reduce residual stress and improve microphone’s performance. Using standard CMOS as the basis for design, this research utilizes large deflection plate theory and five different SRSs categorized by graph theory to construct the finite element models for the evaluation of MEMS microphones. The models are then verified by theories of multilayer plate and corrugated membrane. It is found that beam suspension structure is the best based on six evaluation indexes. According to the sensitivity analysis, reducing structure width can enhance both the mechanical and electric sensitivity, and structure length has the highest sensitivity but can only increase electric sensitivity. The number of SRS has varied effects on performance due to patterns of connection with the diaphragm. A design sequence can be recommended for better SRS. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/10645 |
全文授權: | 同意授權(全球公開) |
顯示於系所單位: | 機械工程學系 |
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