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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 翁宗賢 | |
dc.contributor.author | Hsiang-Lien CHENG | en |
dc.contributor.author | 鄭翔聯 | zh_TW |
dc.date.accessioned | 2021-05-20T21:29:24Z | - |
dc.date.available | 2015-08-20 | |
dc.date.available | 2021-05-20T21:29:24Z | - |
dc.date.copyright | 2010-08-20 | |
dc.date.issued | 2010 | |
dc.date.submitted | 2010-08-18 | |
dc.identifier.citation | 1. D. A. Benson, M. E. Larsen, A. M. Renlund, W. M. Trott, and R. W. Bickes, Jr., “Semiconductor Bridge: A Plasma Generator for the Ignition of Explosives,” J. Appl. Phys. 62(5), 1 September 1987.
2. D. A. Benson, R. W. Bickes, Jr., and R. S. Blewer, Tungsten Bridge for Low Energy Ignition of Explosive and Energetic Materials, US Patent 4976200, Dec. 1990. 3. H. H. Dibiaso, B. A. English, and M. G. Allen, “Solid-Phase Conductive Fuels for Chemical Micro-Actuators,” Sensors and Actuators A: Phys.111,260-266, 2004. 4. 邱宏昇,金屬薄膜點火晶片設計模擬,國立台灣大學應用力學研究所碩士論文,2004年。 5. 洪誌隆,低能量固態點火晶片用於含能材料觸發裝置之設計與研製,國立台灣大學應用力學研究所碩士論文,2006年。 6. 邱銘漢,抗震點火晶片研製,國立台灣大學應用力學研究所博士論文,2008。 7. S.T. Jenq, “High-G Drop Impact Response and Failure Analysis of a Chip Packaged Printed Circuit Board,” International Journal of Impact Engineering ,Vol.34 , pp. 1655-1667,2007 8. E. Suhir, Nonlinear Dynamic Response of a Flexible Thin Plate to Constant Acceleration Applied to its Support Contour, with Applied to Printed Circuit Boards, Used in Avionic Packaging, Inter. Journal of Solids Structure, Vol. 29(1), 41-55, 1992. 9. E. L. Fasanella and K. E. Jackson, Best Practices for Crash Modeling and Simulation, Army Research Laboratory, Vehicle Technology Directorate, Langley Research Center, Hampton, Virginia. 2001. 10. C. T. Lim, Y. M. Teo, and V. P. W. Shim, “Numerical Simulation of the Drop Impact Response of a Portable Electronic Product,” IEEE Transactions on Components and Packaging Technology, 25 (3), 478-475, 2002. 11. 趙海鷗,LS-DYNA動力分析指南,兵器工業出版社,北京市,2003。 12. LS-DYNA Theoretical Manual, V960, Livemore Software Technology Corporation, 1998. 13. Military Standard, MIL-STD-883E Method 2002.4 Test Method Standard for Environment Engineering Considerations, US Dept. of Defense,1998 14. A. Volinsky, N. R. Moody, and W. W. Gerberich, “Nanoindentation of Au and Pt/Cu Thin Films at Elevated Temperatures,” J. Mater. Res., 19, 2650-2657, Sep 2004. 15. R.C. Hibbeler, Mechanics of Materials. 5th edition, New Jersey: Prentice Hall, 2003. 16. 王昶欽,錫球在高速衝擊下的結構反應暫態分析,國立中山大學機械與機電工程所碩士論文,2007。 17. 陳宗湧,防爆門受衝擊載荷時之數值分析,國立台灣大學,碩士論文,2008。 18. LS-DYNA KEYWORD USER’S MANUAL, V971, Vol 1, Livemore Software Technology Corporation, 2007. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/10436 | - |
dc.description.abstract | 不管是民生電子產品或是電火工品,在進行產製前,都須依照使用環境通過不同等級的抗震衝擊的模擬測試,確認產品各部件不會因為工作環境中的衝擊而失效。由於工程技術的演進,電火工品的重要組件電點火頭已經被點火晶片所取代,而點火晶片需與點火頭的電極結合,再與相關的金屬外殼封裝,才可形成功能完整的點火系統,所以思考新的設計,即直接在電點火頭上蒸鍍黃金(Au)薄膜電橋,可直接與點火電路整合,完成點火系統。
與點火晶片相同的需求,在進行產製前,須通過衝擊的實驗測試認證,目的在確認Au薄膜電點火頭各部件是否會因為環境中的衝擊造成失效,然後再設計並且評估所設計的薄膜電橋是否可經由微機電製程實現。 本文以建構數值模型的方法,探討由Kovar合金組成的正負極(中心梢與外殼) ,兩極之間融封玻璃絕緣層的電點火頭結構,在承受高G衝擊模擬時的暫態反應,研究中使用的測試規範是MIL-STD 883E軍規測試規範。 經數值模擬的結果分析得知,整體電點火頭可成功在高達120,000G的強震衝擊下存活,惟填充在點火頭外殼與中心柱間的玻璃部件安全係數雖大於1,但仍小於一般CAE所要求的1.5,本文利用在玻璃下方增加墊片的方式,成功地提高玻璃部件安全係數,增加抗震幅度。 | zh_TW |
dc.description.abstract | To prevent the components from malfunctions due to impacts in the working environment, all the electronic and electro-explosive devices are demanded to pass impact simulation tests. Owing to technological progresses, traditional electrical igniters have been replaced by ignition-chips. To assemble the whole ignition system, ignition-chips are overlaid on the igniter heads and packaged in the compartment cases. This innovative design is to integrate the ignition circuit by directly coating an Au thin film bridge on the igniter head with vacuum evaporation technique to fabricate the ignition device.
Prior to manufacturing, impact tests are usually carried out to validate if this Au thin film bridge can sustain impacts in the working conditions. In this thesis, transient response of the innovative igniter head subject to high-G impact is simulated according to MIL-STD 883E specifications. The simulation results evidence that the igniter head could survive under 120,000 G extremely high impacts. Although the safety factor of the glass part is only slightly larger than 1, it which is still below the common CAE requirement of 1.5. In this thesis, placing a ceramics spacer beneath the filling glass can successfully improve the safety factor of the glass part to over 1.5 that which would effectively enhance the anti-impact capability. | en |
dc.description.provenance | Made available in DSpace on 2021-05-20T21:29:24Z (GMT). No. of bitstreams: 1 ntu-99-R97543078-1.pdf: 5605356 bytes, checksum: fa5dcface9142faad4171abae7fdd2d2 (MD5) Previous issue date: 2010 | en |
dc.description.tableofcontents | 摘要 I
Abstract II 目錄 III 圖目錄 V 符號表 IX 第一章 序論 1 1-1 研究動機與目的 1 1-2 文獻回顧 3 1-3 本文內容 3 第二章 理論與相關規範 8 2-1 動態模擬分析理論 8 2-1-1 LS-DYNA軟體簡介 8 2-1-2 空間網格描述法 8 2-1-3 Lagrange物質描述 9 2-1-4 統御方程式 10 2-1-5 時間積分法 13 2-1-6 Johnson Holmquist Cermics材料模型 16 2-2 MIL-STD 883E衝擊規範介紹 17 2-3 破壞準則 18 第三章 數值模擬建立與設定流程 27 3-1 建立CAD模型 27 3-2 定義元素類型 28 3-3 設定材料特性 29 3-4 劃分網格 30 3-5 設定邊界條件與負載 30 3-6 定義接觸類型 30 3-7 數值分析求解 31 3-8 後處理器 31 第四章 數值模擬結果與討論 41 4-1 模擬結果 41 4-1-1 Au薄膜電橋 41 4-1-2 Kovar合金 42 4-1-3 玻璃部件 43 4-2 Au薄膜厚度與形狀對模擬結果的影響 43 4-3 改進玻璃安全係數的方法:增加墊片 44 第五章 結論與未來展望 58 5-1 結論 58 5-2 未來展望 58 參考文獻 60 | |
dc.language.iso | zh-TW | |
dc.title | 金薄膜點火器之設計與高G值衝擊測試模擬 | zh_TW |
dc.title | Design and High-G Shock test Simulation of Thin-Film Au Igniter | en |
dc.type | Thesis | |
dc.date.schoolyear | 98-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 張正憲,黎進財,邱銘漢 | |
dc.subject.keyword | 衝擊模擬,點火薄膜,LS-DYNA,ANSYS, | zh_TW |
dc.subject.keyword | High-G impact,metal igniting film,LS-DYNA,ANSYS, | en |
dc.relation.page | 61 | |
dc.rights.note | 同意授權(全球公開) | |
dc.date.accepted | 2010-08-19 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 應用力學研究所 | zh_TW |
顯示於系所單位: | 應用力學研究所 |
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