從台灣到印度：打造第一座十二吋晶圓廠與產業生態系

Abstract

本論文主要在研究及回顧力晶積成電子（PSMC）與塔塔電子（TEPL）策略結盟的個案探討，從2022年6月到2024年9月，雙方歷時27個月評估談判後，在新德里正式簽訂台印跨國技術移轉合作，啟動印度第一座十二吋晶圓廠專案。期間，塔塔電子亦獲得印度政府半導體基金支持，包含Gujarat晶圓代工與Assam封裝測試建廠計劃，總投資額一兆一千八百億印度盧比(₹118,000 crore)，約一百四十億美金(US$14 billion)。 本合作專案基於BLT商務模式，由力晶積成電子協助塔塔電子進行建廠（Build）、授權（License）與技轉（Transfer）等專業服務，從台灣到印度建置晶圓代工廠與半導體產業價值鏈。根據印度建國百年願景，目標在2047年進入已開發經濟體，其中2030到2032年的半導體製造、電子零組件與資通訊產業等基礎建設，為其階段性重要任務。 在個案發展期間，力晶積成電子同步推展企業創新與組織變革，以探索後疫情時代，詭譎多變的國際政經、產業動態及典範轉移機會。本研究提出UFO策略架構，進行政策制定與智庫分析，從宏觀的趨勢發展（Understanding megatrends）、產業的賽道選擇（Finding way of the game）、造局者思考框架（Outside the boxes）等，擬定3D AI Foundry和Fab IP Foundation做為企業轉型再成長的策略拐點（Strategic inflection point）；在創辦人領導的經營團隊，與力晶集團協作文化下，聚焦建廠專業及量產製造等核心價值，全面提升國際合作與發展契機。

The India’s first 12-inch semiconductor fab was studied based on a strategic partnership between Powerchip and Tata in the early 2020s to mid-2020s. Totally Tata Electronics has been granted ₹118,000 crore (or US$14 billion) to build Gujarat Fab and Assam OSAT in the ISM 1.0 projects. In terms of BLT business model, i.e. Build, License, and Transfer, foundry technology platforms and semiconductor value chains have been strategically deployed from Taiwan to India. To enter a developed nation in 2047, India government aims a global chip powerhouse by 2030-2032. In this case, simultaneously, the UFO framework was introduced for an enterprise transformation. UFO is a part of think tank to leverage limited resources in a global dynamic, including 1) Understanding megatrends, 2) Finding way of the game, and 3) Outside the boxes in the corporate business strategy. Eventually Fab IP Foundation and 3D AI Foundry were concluded as a significant growth at the strategic inflection point. The core values comprised of fab construction and manufacturing experience were directly driven by founder’s mentality and corporate culture.