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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 胡星陽 | zh_TW |
| dc.contributor.advisor | Shing-Yang Hu | en |
| dc.contributor.author | 鮑貴軍 | zh_TW |
| dc.contributor.author | Guijun Bao | en |
| dc.date.accessioned | 2025-12-31T16:06:34Z | - |
| dc.date.available | 2026-01-01 | - |
| dc.date.copyright | 2025-12-31 | - |
| dc.date.issued | 2025 | - |
| dc.date.submitted | 2025-12-01 | - |
| dc.identifier.citation | [1] 馬歇爾, A. (1890). Principles of Economics. London: Macmillan.
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| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/101145 | - |
| dc.description.abstract | 進入21世紀以來,全球科技產業特別是高科技的高速發展加速了全球資訊化進程。隨著中美貿易摩擦惡化,新冠病毒的減弱,俄烏戰爭的持續等因素,引發了全球供應鏈的大混亂。在這一深刻變革中,由於半導體晶片的嚴重缺貨,讓原本就非常重要的半導體晶片,再一次引發更大的關注,其中顯著現象就是中國台系的台積電晶圓廠由於制程的先進性被各國強壓到所在地建立晶圓廠。半導體技術進步神速,其應用面遍及在各個領域。如高端領域,支撐著航天器精密系統的可靠運行,火箭的發射升天;在消費電子領域,驅動著智慧手機等設備性能的持續躍升;在交通與通信領域,更是自動駕駛系統實現的關鍵基礎,以及5G乃至未來6G等先進通信技術廣泛部署的物質載體,最新的人工智慧直接大火到要改變未來世界。可以說,從尖端裝備到日常應用,現代科技體系的諸多關鍵環節都高度依賴半導體技術,其戰略地位日益凸顯。相應地,晶片的設計、製造及封裝等全產業鏈環節,已不僅是技術討論的熱點,更上升為國家層面科技與產業戰略的重要目標。半導體技術的持續突破以及相關產業的健康發展,對於提升國家綜合競爭力、保障經濟安全、促進社會生產效率和生活品質的整體躍升,均具有至關重要的意義。
A公司是一家半導體銷售型企業,從事半導體先進封裝設備的銷售,產品涵蓋了晶片封裝測試工藝的多個工序。作為一家銷售型企業,A公司的專長是對應客戶各種形式的半導體晶片封裝工藝制程,並提供與之相配套的解決方案及技術支援。本文將會以A公司為載體,運用研究生期間所學習的PEST和波特五力分析法、內部因素和價值鏈分析法等工具,重新對A公司的內部環境、外部環境及整體行業做出深入的剖析。在這一過程中,對A公司的經營現狀和轉型升級做了深入的瞭解,匯總了一定量的資料,確認了A公司轉型升級應採取的策略。 本文以“半導體先進封裝設備企業轉型策略研究”作為選題,通過上海A半導體先進封裝設備公司未來五年的戰略規劃為抓手,旨在探討上海A公司在半導體先進封裝測試行業中的轉型升級策略。隨著全球半導體行業的快速發展和先進制程技術的不斷演進,地緣政治導致產品安全風險突出,行業競爭日益激烈。銷售型企業在傳統模式下,面臨著巨大的挑戰。上海A公司作為一家在該領域有著多年銷售經驗的企業,積累了豐富的產品資源,並與國內外眾多封裝測試廠商建立了穩固的合作關係。本文將在此背景下,提出問題、分析對策與思路,探尋轉型發展的各種可能性,探討可能面臨的風險與挑戰,明確保障措施,聚焦擴大市場份額,建立上下游生態鏈,形成上海A公司未來五年的可持續發展的規劃路徑。 | zh_TW |
| dc.description.abstract | Since the beginning of the 21st century, the rapid development of the global technology industry, particularly high-tech, has accelerated the process of global informatization. With the worsening of Sino-US trade friction, the waning of the COVID-19 pandemic, and the ongoing Russia-Ukraine war, factors such as these have triggered significant disruptions in the global supply chain. Amid this profound transformation, the severe shortage of semiconductor chips has once again drawn even greater attention to the already crucial semiconductor sector. A notable example is the pressure on other countries to establish wafer fabs in Taiwan's TSMC wafer fabs due to their advanced manufacturing processes. Semiconductor technology is advancing at a breakneck pace, with applications spanning a wide range of fields. For example, in high-end sectors, it supports the reliable operation of precision systems in spacecraft and the launch of rockets. In consumer electronics, it drives the continuous improvement of the performance of devices like smartphones. In transportation and communications, it is the critical foundation for the implementation of autonomous driving systems and the material carrier for the widespread deployment of advanced communication technologies such as 5G and, in the future, 6G. The latest artificial intelligence is so prevalent that it threatens to transform the future world. From cutting-edge equipment to everyday applications, many key components of the modern technological system rely heavily on semiconductor technology, and its strategic importance is becoming increasingly prominent. Accordingly, the entire chip industry chain, including chip design, manufacturing, and packaging, has become not only a hot topic of technical discussion but also a key objective of national science and technology and industrial strategy. Continuous breakthroughs in semiconductor technology and the healthy development of related industries are crucial for enhancing the country's overall competitiveness, ensuring economic security, and promoting overall improvements in social productivity and quality of life.
Company A is a semiconductor sales company specializing in the sale of advanced semiconductor packaging equipment, covering multiple steps in the chip packaging and testing process. As a sales company, Company A specializes in responding to various semiconductor chip packaging processes for its customers and providing supporting solutions and technical support. This article will use Company A as a vehicle and utilize tools learned during graduate studies, such as PEST, Porter's Five Forces Analysis, internal factors, and value chain analysis, to conduct an in-depth analysis of Company A's internal and external environments, as well as the overall industry. This process provides an in-depth understanding of Company A's current operating status and its transformation and upgrading efforts, compiles a certain amount of data, and identifies strategies for its transformation and upgrading. This paper takes "Research on the Transformation Strategy of Semiconductor Advanced Packaging Equipment Enterprises" as its topic. By taking the strategic planning of Shanghai A Semiconductor Advanced Packaging Equipment Company for the next five years as a starting point, it aims to explore the transformation and upgrading strategy of Shanghai A Company in the semiconductor advanced packaging and testing industry. With the rapid development of the global semiconductor industry and the continuous evolution of advanced process technology, geopolitical factors have led to prominent product safety risks and increasingly fierce competition in the industry. Sales-oriented companies face huge challenges under the traditional model. As a company with many years of sales experience in this field, Shanghai A Company has accumulated rich product resources and established solid cooperative relationships with many packaging and testing manufacturers at home and abroad. Against this background, this paper will raise questions, analyze countermeasures and ideas, explore various possibilities for transformation and development, discuss possible risks and challenges, clarify safeguards, focus on expanding market share, establish upstream and downstream ecological chains, and form a planning path for the sustainable development of Shanghai A Company in the next five years. | en |
| dc.description.provenance | Submitted by admin ntu (admin@lib.ntu.edu.tw) on 2025-12-31T16:06:34Z No. of bitstreams: 0 | en |
| dc.description.provenance | Made available in DSpace on 2025-12-31T16:06:34Z (GMT). No. of bitstreams: 0 | en |
| dc.description.tableofcontents | 目次
口試委員會審定書 I 致謝 II 中文摘要 III ABSTRACT V 目次 VII 圖次 IX 表次 X 第一章 緒論 1 1.1 研究背景與意義 1 1.2 公司轉型理論基礎和國內外文獻綜述 3 1.3 論文研究思路及目標 8 第二章 A公司銷售環境分析 11 2.1 宏觀環境分析—PEST模型 11 2.2 行業分析 17 2.3 客戶需求分析 19 第三章 A公司現狀和存在問題分析 21 3.1 A公司發展歷史和現狀 21 3.2 A公司內部因素評價矩陣以及價值鏈分析 28 3.3 A公司存在問題及根因分析 32 第四章 A公司銷售型企業轉型策略 34 4.1 客戶層面 36 4.2 管理層面 38 4.3 產品層面 44 第五章 A公司銷售型企業轉型策略實施與保障措施 52 5.1 實施方案 52 5.2 保障體系構建:多維驅動企業轉型升級 57 第六章 結論與展望 61 6.1 研究結論與管理啟示 61 6.2 研究不足與未來展望 62 參考文獻 63 圖次 圖1-1:技術路線圖 10 圖3-1:A公司服務行業用戶 24 圖3-2:A公司銷售產品 24 圖3-3:先進封裝制程和設備 25 圖4-1:客戶、管理與產品三者關係 34 圖4-2:A公司精細化管理的三大舉措 39 圖4-3:A公司提升產品差異化的維度 45 圖4-4:撕膜研磨設備流程優化 46 圖4-5:A公司產品組合方式 47 圖4-6:高附加值技術服務銷售方法 50 表次 表3-1:內部因素問卷調查表 29 表3-2:基本價值鏈和輔助價值鏈分析表 30 表4-1:客戶資源分層分類管理表 37 表4-2:半導體封測設備上料機常用部件及國內供應商 40 表4-3:鐵三角和傳統銷售對比表 43 表4-4:A定制化產品 48 表4-5:解決方案銷售的邏輯與方法 48 表5-1:A公司半導體先進封裝銷售型企業轉型策略實施計畫 53 | - |
| dc.language.iso | zh_TW | - |
| dc.subject | 先進封裝設備 | - |
| dc.subject | 半導體 | - |
| dc.subject | 轉型升級 | - |
| dc.subject | advanced packaging equipment | - |
| dc.subject | semiconductor | - |
| dc.subject | transformation and upgrading | - |
| dc.title | 上海A半導體公司戰略轉型研究 | zh_TW |
| dc.title | Research on Strategic Transformation of Shanghai A Semiconductor Company | en |
| dc.type | Thesis | - |
| dc.date.schoolyear | 114-1 | - |
| dc.description.degree | 碩士 | - |
| dc.contributor.oralexamcommittee | 莊裕澤;黃蓉;彭賀 | zh_TW |
| dc.contributor.oralexamcommittee | Yuh-Jzer Joung;Rong Huang;He Peng | en |
| dc.subject.keyword | 先進封裝設備,半導體轉型升級 | zh_TW |
| dc.subject.keyword | advanced packaging equipment,semiconductortransformation and upgrading | en |
| dc.relation.page | 65 | - |
| dc.identifier.doi | 10.6342/NTU202504699 | - |
| dc.rights.note | 同意授權(限校園內公開) | - |
| dc.date.accepted | 2025-12-02 | - |
| dc.contributor.author-college | 管理學院 | - |
| dc.contributor.author-dept | 臺大-復旦EMBA境外專班 | - |
| dc.date.embargo-lift | 2026-01-01 | - |
| 顯示於系所單位: | 臺大-復旦EMBA境外專班 | |
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