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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/100180完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 張子璿 | zh_TW |
| dc.contributor.advisor | Tzu-Hsuan Chang | en |
| dc.contributor.author | 洪睿哲 | zh_TW |
| dc.contributor.author | Ruei-Jhe Hong | en |
| dc.date.accessioned | 2025-09-24T16:45:51Z | - |
| dc.date.available | 2025-09-25 | - |
| dc.date.copyright | 2025-09-24 | - |
| dc.date.issued | 2025 | - |
| dc.date.submitted | 2025-08-13 | - |
| dc.identifier.citation | 1. Wei, T., et al., Two dimensional semiconducting materials for ultimately scaled transistors. IScience, 2022. 25(10).
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Brand, S., et al., Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies. Journal of Micro/Nanolithography, MEMS, and MOEMS, 2014. 13(1): p. 011207–011207. | - |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/100180 | - |
| dc.description.abstract | 三維積體電路 (3DIC)可大幅提升元件密度，突破傳統製程的限制，然而其垂直堆疊架構亦導致嚴重的熱集中問題。本篇研究提出透過結合二維石墨烯與一維奈米碳纖維 (CNFs)，有效地提升封裝材料之熱導率。本研究採用兩階段分散策略，將填料導入環氧樹脂中形成連續的熱傳導網絡，而預混製程 (Pre-mixed process) 能夠有效的分散一維/二維材料避免石墨烯回疊 (Re-stacking)。研究中亦探討溶劑選擇的重要性，選擇適當溶劑可確保填料均勻分散並與環氧樹酯基材具有良好介面結合與分散特性。此外製程的應用不限於石墨烯，研究中實現以電絕緣特性佳的氮化硼 (h-BN)進行製備，進一步拓展製程的適配性，研究針對預混填料/環氧樹脂(Premix/Epoxy) 系統提出多項提升垂直熱導的策略，例如引入不同尺度的材料(零維/一維/二維材料)、提升填料分散性、建構微觀垂直熱導網絡，並透過多種量測方法 (例如Hot Disk、雷射閃光法及 ASTM D5470規範) 進行驗證。
為驗證其實用性，研究於微米級銅柱結構的覆晶封裝晶片 (flip-chip) 封裝中進行測試，掃描式超聲波分析 (Scanning Acoustic Tomography, SAT) 結果顯示，材料可實現幾乎完全填充且空洞生成極少。總結來說，本研究建立了一套可擴展的製程策略並證實能夠有效提升垂直熱導，適用於高性能之封裝材料，應用於下個世代 3DIC 及異質整合平台之需求。 | zh_TW |
| dc.description.abstract | Three-dimensional IC (3DIC) integration pushes device density far beyond conventional limits, but the vertical architecture concentrates heat seriously. This work outlines an integrated approach to boost underfill thermal conductivity by pairing two-dimensional graphene with one-dimensional carbon nanofibers (CNFs). A two-stage dispersion route incorporates these fillers into an epoxy, knitting a continuous heat-spreading network. Careful solvent selection, most effectively N-methyl-2-pyrrolidone (NMP), secures uniform dispersion and strong filler–matrix adhesion, while the same premix protocol proves adaptable to electrically insulating h-BN systems, widening the design palette. In the work, strategies are performed to improve the thermal conductivity of the filler/epoxy system. For instance, introducing materials with different dimensions (zero-, one-, two-dimensional material), improving filler dispersion quality, and constructing the thermal dissipation network. Several axial thermal conductivity measurements (Hot Disk, laser-flash, ASTM D5470) provided thermal conductivity evidence, with the graphene/CNF premix outperforming the other cases.
Practical relevance was tested on a flip-chip assembly featuring micron-scale copper pillars. Capillary flow trials and Scanning Acoustic Tomography verified near-complete cavity fill with few voids. Collectively, the results establish a scalable strategy for manufacturing high-performance, thermally conductive underfills compatible with next-generation 3DIC and heterogeneous-integration platforms. | en |
| dc.description.provenance | Submitted by admin ntu (admin@lib.ntu.edu.tw) on 2025-09-24T16:45:51Z No. of bitstreams: 0 | en |
| dc.description.provenance | Made available in DSpace on 2025-09-24T16:45:51Z (GMT). No. of bitstreams: 0 | en |
| dc.description.tableofcontents | 致謝 i
摘要 ii Abstract iii 目次 v 圖次 ix 表次 xiv Chapter 1 1 Introduction and Moore’s Law 1 1.1 Introduction to IC technology and Moore’s law 1 1.2 The impact of 3DIC and its role toward miniaturization 3 1.3 Thermal conductivity issues in 3DIC 5 1.4 Introduction of two-dimensional (2D) material 7 Chapter 2 11 Challenges in 3DIC 11 2.1 IC Packaging: A Foundational Introduction 11 2.2 Importance of IC packaging in Modern Electronics 13 2.3 3D packaging and Heterogeneous Integration 15 2.4 Common solutions to 3DIC thermal conductivity issues 19 2.4.1 2D Materials for Thermal Conductivity Boost 20 2.5 Thermal conductivity measurement approaches 24 2.5.1 Hot disk method 26 2.5.2 Laser Flash Analysis 29 2.5.3 ASTM D5470 31 2.6 Recent advances in underfill material 34 Chapter 3 39 Improving Thermal Conductivity Using Graphene-Based Composite Material (GBCM) 39 3.1 Two-step process to fabricate well-dispersed underfill material 39 3.1.1 Fabrication of Graphene-based Composite Material (GBCM) 39 3.1.2 Fabrication of GBCM/epoxy composite 43 3.2 Eco-friendly premix fabrication process: water as medium 44 3.3 Material characterization of pre-mixed film made by different processes 46 3.3.1 Raman spectroscopy 46 3.3.2 Scanning Electron Microscopy 50 3.3.3 Zeta potential verification 52 3.4 Dissolution issues with epoxy 58 3.5 Surface bonding properties and Specific surface area verification 61 3.5.1 FTIR spectroscopy 61 3.5.2 Brunauer–Emmett–Teller (BET) analysis 63 Chapter 4 66 Further study of proposed underfill system 66 4.1 Anisotropic thermal conductivity measurement 66 4.2 Enhancement of underfill thermal conductivity 68 4.2.1 Parameters and requirements of the Hot disk method 68 4.2.2 Underfill κz measured through the Hot disk method 76 4.2.3 LFA measurement results 79 4.2.4 ASTM D5470 steady-state TC Measurement 81 4.3 Filler/Epoxy Interface Engineering via Titanate Coupling Agents 82 4.4 Adoptability of pre-mixed film process in h-BN system 85 4.4.1 Process flow to fabricate h-BN/CNF pre-mixed thin film 86 4.4.2 IPA residue and true density correction 87 4.4.3 Incorporation of CNT with BN/CNF 89 4.5 Flip chip bonding with underfill 91 4.5.1 Scanning Acoustic Tomography measurement 94 4.5.2 Results of underfill coverage quality 96 Chapter 5 99 Conclusion and Future Works 99 Reference 101 | - |
| dc.language.iso | en | - |
| dc.subject | 三維積體電路 | zh_TW |
| dc.subject | 積體電路封裝 | zh_TW |
| dc.subject | 石墨烯 | zh_TW |
| dc.subject | 二維材料 | zh_TW |
| dc.subject | 垂直熱導 | zh_TW |
| dc.subject | 3DIC | en |
| dc.subject | IC Packaging | en |
| dc.subject | Thermal management | en |
| dc.subject | Graphene | en |
| dc.subject | Axial thermal conductivity | en |
| dc.subject | 2D material | en |
| dc.title | 石墨烯基高熱導複合材料用於三維積體電路封裝之研究 | zh_TW |
| dc.title | High-Thermal-Conductivity Underfill for 3DIC Based on Graphene-based Composites | en |
| dc.type | Thesis | - |
| dc.date.schoolyear | 113-2 | - |
| dc.description.degree | 碩士 | - |
| dc.contributor.oralexamcommittee | 林致廷;吳肇欣;鄭宇翔;劉建豪 | zh_TW |
| dc.contributor.oralexamcommittee | Chih-Ting Lin;Chao-Hsin Wu;Yu-Hsiang Cheng;Chien-Hao Liu | en |
| dc.subject.keyword | 三維積體電路,垂直熱導,二維材料,石墨烯,積體電路封裝, | zh_TW |
| dc.subject.keyword | Thermal management,3DIC,Axial thermal conductivity,2D material,Graphene,IC Packaging, | en |
| dc.relation.page | 106 | - |
| dc.identifier.doi | 10.6342/NTU202504262 | - |
| dc.rights.note | 同意授權(限校園內公開) | - |
| dc.date.accepted | 2025-08-15 | - |
| dc.contributor.author-college | 重點科技研究學院 | - |
| dc.contributor.author-dept | 元件材料與異質整合學位學程 | - |
| dc.date.embargo-lift | 2030-08-07 | - |
| 顯示於系所單位： | 元件材料與異質整合學位學程 | |
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