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Browsing by Advisor Tung-Han Chuang

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Showing results 1 to 7 of 7

Publication Year	Title	Author(s)	Department
2023	SiC 晶背金屬層優化與銀奈米孿晶低溫接合研究 Optimization of SiC backside metallization layer and low-temperature bonding of silver nanotwinned film	李昕融; Hsin-Jung Lee	材料科學與工程學系
2023	氧化亞銅薄膜之高功率脈衝磁控濺鍍製程開發及其在鈣鈦礦太陽能電池之應用 Development of high-power impulse magnetron sputtering process of Cu2O thin films and its application of perovskite solar cells	陳胤宏; Yin-Hung Chen	材料科學與工程學系
2024	碳化矽晶背Cr/Ni/Ag與Cr/Ag奈米孿晶薄膜分析及其與DBC陶瓷基板固晶接合 Analyses of Backside Metallized Cr/Ni/Ag and Cr/Ag Nanotwinned Thin Films on SiC Chips and Die Bonding with DBC Ceramic Substrates	張哲元; Che-Yuan Chang	材料科學與工程學系
2023	碳化矽背晶研磨拋光與Ti/Ag奈米孿晶鍍膜及其與DBC陶瓷基板固晶接合 Backside Grinding and Polishing for SiC Wafers and Ti/nanotwinned Ag Metallization and Die Bonding with DBC Ceramic substrates	朱家慶; Chia-Ching Chu	材料科學與工程學系
2023	碳化矽背晶鍍等軸粗晶與奈米孿晶Cu 薄膜及其與DBC陶瓷基板銀燒結固晶接合 Backside Metallization of Equiaxial Coarse Grained and Nanotwinned Cu Thin Films on SiC Chips and their Ag Sintering Die Bonding with DBC Ceramic Substrates	Devi Indrawati Syafei; Devi Indrawati Syafei	材料科學與工程學系
2023	背晶金屬化矽晶片與DBC陶瓷基板固晶接合研究 Study on Die Bonding of Backside Metallized Si Chip with DBC Ceramic Substrates	邱冠諭; Kuan-Yu Chiu	材料科學與工程學系
2022	銅單晶與多晶濺鍍銅奈米孿晶薄膜及其低溫接合研究 Study On Sputtering Nano-twinned Cu Thin Film On Single / Polycrystalline Cu And Low Temperature Bonding	葉于禎; Yu-Chen Yeh	材料科學與工程學系

Showing results 1 to 7 of 7