Browsing by Advisor Cheng-Hung Kao
Showing results 1 to 1 of 1
| Publication Year | Title | Author(s) | Department |
|---|---|---|---|
| 2022 | 排氫模型建立與無電鍍銅之側對側接合技術開發 Development of Model for Bubble Dislodgment and Cu-Cu Side-by-side Interconnection Using Controlled Electroless Cu Plating | 陳昱安; Yu-An Chen | 材料科學與工程學系 |