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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
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dc.contributor.advisor | 陳希立 | |
dc.contributor.author | Wei-Che Hsiao | en |
dc.contributor.author | 蕭惟哲 | zh_TW |
dc.date.accessioned | 2021-06-13T08:15:09Z | - |
dc.date.available | 2015-12-31 | |
dc.date.copyright | 2005-07-26 | |
dc.date.issued | 2005 | |
dc.date.submitted | 2005-07-20 | |
dc.identifier.citation | 參考文獻
1. Harper, D. R. and Brown, W. B., “Mathematical Equations for Heat Conduction in the Fins of Air Cooled Engine,” NACA Report, No. 158, 1922. 2. Strassberg, D., 'Cooling Hot Microprocessor,' EDN, Vol. 39, pp. 40-50, 1994. 3. Grover, G. M., “US Patent No. 3229759,” 1963. 4. Maydanik, Yu. F., 'Loop Heat Pipes – Development and Application,' the SEMINAR of Department of Mechanical Engineering National Taiwan University, Oct. 2003. 5. Murthy, S. S., Joshi, Y. K. and Nakayama, W., 'Single Chamber Compact Thermosyphons with Micro-Fabricated Components,' Proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomenon in Electronic Systems (I-Them), Las Vegas, NV, May 2000. 6. Ma, Z. N., Sobhan, C. B., Wong, T. N. and Huang, X. Y., 'Experimental Investigations on a Closed Mini Thermosyphon,' IEEE/CPMT Electronics Packaging Technology Conference, 1998 7. Ramaswamy, C., Joshi, Y. K. and Nakayama, W., 'Thermal Performance of a Compact Two-Phase Thermosyphon: Response to Evaporator Confinement and Transient Loads,' Journal of Enhanced Heat Transfer, Vol. 6, No. 2-4, pp. 279-288, 1999. 8. Ramaswamy, C., Joshi, Y. K., Nakayama, W. and Johnson, W. B., 'Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon,' IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, Mar. 2000. 9. Pal, A., Joshi, Y. K., Monem H., Patel, C. D. and Wenger, T. M., 'Design and Performance Evaluation of a Compact Thermosyphon,' IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 4, Dec. 2002 10. Yuan, L., Joshi, Y. K. and Nakayama, W., 'Effect of Condenser Location and Imposed Circulation on the Performance of a Compact Two-Phase Thermosyphon,' Microscale Thermophysical Engineering, Vol. 7, pp. 163-179, 2003 11. NA, M. K., Jeon, J. S., Kwak, H. Y. and Nam, S. S., 'Experimental Study on Closed-Loop Two-Phase Thermosyphon Devices for Cooling MCMs,' Journal of Heat Transfer Engineering, Vol. 22, pp. 29-39, 2001. 12. Khodabandeh, R. and Palm, B., 'Influence of System Pressure on the Boiling Heat Transfer Coefficient in a Closed Two-Phase Thermosyphon Loop,' International Journal of Thermal Sciences, Vol. 41, pp. 619-624, 2002. 13. Zuo, Z. J. and Dussinger, P. M., 'Heat Pipe Vapor Chamber Cold Plate Modeling, Fabrication, and Testing,' Proceedings of the 1998 ASME International Mechanical Engineering Congress and Exposition, pp. 281-286, 2000. 14. Thermacore International, Inc., http://www.thermacore.com/ 15. Jacob, M., 'Heat Transfer,' Wiley, New York, pp.636-638,1949. 16. Kurihari, H. M. and Myers, J. E., 'Effects of Superheat and Roughness on the Boiling Coefficients,' AIChE J., vol. 6, no. 1, pp. 83-91, 1960. 17. Griffith, P. and Wallis, J. D., 'The Role of Surface Conditions in Nucleate Boiling,' Chem. Eng. Prog. Symp. Ser., vol.55, no.29, pp.103-110, 1959. 18. Chaudri, I. H. and McDougall, I. R., 'Aging Studies in Nucleate Pool Boiling of Isopropyl Acetate and Perchlorethylene, ' Int. J. Heat Mass Transfer, vol.12, pp.681-688,1969. 19. Bonilla, C. F., Grady, J. J., and Avery, G. A., 'Pool Boiling Heat Transfer from Scored Surfaces,' Chem. Eng. Prog. Symp. Ser., vol. 61, no. 57, pp.280-288, 1965. 20. O’Neill, P. S.,Gottzman, C. F., and Terbot, J. W., 'Novel Heat Exchanger Increases Cascade Cycle Efficiency for Natural Gas Liquefaction,in Advances in Cryogenic Engineering, ' ed. K. D. Timmerhaus, pp.420-437,Plenum,New York, 1972. 21. Feldman, K.T., 'Analysis and Design of Heat Pipes, ' University of New Mexico, Albuquerque, 1970. 22. Rohsenow, W. M., 'Boiling,' in Handbook of Heat Transfer, W. M. Rohsenow and J. P. Hartnett eds., Sec. 13, McGraw-Hill Book Company, New York, 1973. 23. Collier, J. G. and Thome, J. R., 'Convective Boiling and Condensation,' 3rd ed., Clarendon Press, Oxford, UK, 1994. 24. Bankoff, S. G., 'Ebullition from Solid Surfaces in the Absence of a Pre-existing Gaseous Phase,' Transaction of ASME, Vol. 79, pp. 735, 1957 25. Czikk, A. M. and O’Neill, P. S., 'Correlation of Nucleate Boiling from Porous Metal Films, ' in Advances in Enhanced Heat Transfer, eds. J. M. Chenoweth, J. Kaellis, J. W. Michael, and S. Shenkman, pp. 103-113, ASME, New York, 1979. 26. Farber, E. A. and Scorah, E. L., 'Heat Transfer to Water Boiling under Pressure,' Trans. ASME, Vol. 70, pp. 369, 1948. E. A. Farber and E. L. Scorah, 'Heat Transfer to Water Boiling under Pressure,' Trans. ASME, Vol. 70, pp. 369, 1948. 27. Moore, F. D. and Mesler, R. B., ”The Measurement of Rapid Surface Temperature Flucturations During Nucleate Boiling of Water,” AIChE J., vol7,pp.620-624, 1961. 28. Handricks, R. C. and Sharp, R. R., 'Initiation of Cooling Due to Bubble Growth on a Heating Surface, 'NASA TND-2290, April 1964. 29. 張顥瀚,「迴路式熱虹吸蒸氣腔體之研究」,碩士論文,國立臺灣大學機械工程學研究所,民國九十三年六月(2004)。 30. 潘欽,「沸騰熱傳與雙相流」,國立編譯館,俊傑書局,民國九十年六月(2001)。 | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/36771 | - |
dc.description.abstract | 隨著電子工業的發展,電子產品不斷朝著高性能、小體積的方向發展,然而其單位面積的發熱量卻是越來越高,因此也就產生散熱方面的問題,早期解決的方法為利用鰭片加上風扇來解決,然時至今日,此方法已無法解決即將出現的下一代新型電子設備,故乃需要使用其他方法來解決新一代的電子設備散熱問題。因此本研究探討以水為工作介質時,兩相封閉迴路熱虹吸式散熱系統(Two Phase Close Loop Thermosyphon Cooling System )在不同參數下,整體的散熱性能表現,兩相封閉迴路熱虹吸式散熱系統包含了蒸發器、冷凝器與絕熱管段,其工作原理主要是利用在蒸發器內的工作流體吸收熱量,藉由蒸發或沸騰的機制產生相變化成為氣態,經由絕熱管段抵達冷凝器並將熱藉由冷凝器迅速地傳至外界後凝結成為液態。本研究探討以切削溝槽板、蝕刻板、以及燒結板三種不同類型之強化沸騰表面結構為主之蒸發器搭配垂直形式之冷凝器,在各充填量與加熱率下的性能表現,再與前人比較冷凝器形式之差異對系統性能之影響,以作為未來之改進方向。研究發現,系統總熱阻、蒸發熱阻、及冷凝熱阻大致上皆隨著加熱功率的上升而減小,顯示本系統適用於高發熱功率之電子元件散熱;且當強化沸騰表面為燒結板、工作流體充填量為15%,此時蒸發器內產生以薄膜蒸發為主的相變化機制,因此本系統會有最佳之性能表現。 | zh_TW |
dc.description.abstract | With the development of electronic industry, electronic components keep going for high performance and small volume. Since the heat in unit area is getting higher and higher, the problem of cooling appears. In early days, people solve these problems with fins and fans, but this method won’t work for the electronic components of next generation. So we have to solve the problem of cooling the electronic components of next generation in other ways.
In the research, we studied the performance of Two Phase Close Loop Thermosyphon Cooling System under different parameter with water as working fluid. There are evaporator, condenser, and adiabatic section in the system. The working fluid in the evaporator absorbs the heat from the electronic components and changes its phase to vapor by the mechanism of evaporation or boiling. Then the vapor goes through adiabatic section to the condenser to release the heat and condense. There are three enhanced surfaces-grooved surface, etched surface, and sintered surface with vertical condenser for the system. We studied the performance of these three surfaces under different filling ratio and power. Then compared the performance of condenser with Chang’s[29]. In the research, it was found that the total thermal resistance, evaporator thermal resistance, and condenser thermal resistance are all going down with the increasing power. It says that the system is suitable for cooling the electronic components of next generation. And we also found that because of thin film evaporation, the system will have the best performance at 15% filling ratio with sintered surface. | en |
dc.description.provenance | Made available in DSpace on 2021-06-13T08:15:09Z (GMT). No. of bitstreams: 1 ntu-94-R92522311-1.pdf: 2486036 bytes, checksum: ad21913792006e8be9839f38ee10e1aa (MD5) Previous issue date: 2005 | en |
dc.description.tableofcontents | 目 錄
摘 要 I Abstract II 目 錄 III 圖目錄 V 表目錄 VIII 符號說明 IX 第一章 緒論 1 1-1 前言 1 1-2 研究動機與目的 2 1-3 文獻回顧 3 第二章 基本理論 8 2-1 熱管原理 8 2-1.1熱管 8 2-1.2兩相熱虹吸管 13 2-1.3兩相迴路式熱虹吸管 14 2-2 沸騰基本理論 15 2-2.1 沸騰熱傳簡介 15 2-2.2 沸騰表面增強原理 18 2-2.3 沸騰理論模式 19 2-3分析模式 22 2-3.1熱阻模型 22 2-3.2介面熱阻 24 2-3.3蒸發熱阻 26 2-3.4冷凝熱阻 27 2-3.5對流熱阻 28 第三章 研究方法 30 3-1實驗方法 30 3-1.1實驗系統 30 3-1.2工作原理 32 3-1.3實驗設備 32 3-1.4實驗參數 34 3-1.5實驗流程 36 3-2誤差分析 38 第四章 結果與討論 40 4-1 加熱率對系統性能的影響 40 4-2 充填量對系統性能的影響 43 4-3 沸騰表面對系統性能的影響 47 4-4 冷凝器形式對系統性能的影響 49 第五章 結論與建議 51 5-1 結論 51 5-2 建議 53 參考文獻 55 | |
dc.language.iso | zh-TW | |
dc.title | 兩相封閉迴路式熱虹吸散熱系統 | zh_TW |
dc.title | Two Phase Close Loop Thermosyphon Cooling System | en |
dc.type | Thesis | |
dc.date.schoolyear | 93-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 陳炳煇,田華忠,柯明村 | |
dc.subject.keyword | 熱虹吸,強化沸騰表面,薄膜蒸發, | zh_TW |
dc.subject.keyword | Thermosyphon,Boiling Enhancement,Film Evaporation., | en |
dc.relation.page | 88 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2005-07-20 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
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