Browsing by Author 楊挺立
Showing results 1 to 2 of 2
Publication Year | Title | Author(s) | Department |
---|---|---|---|
2014 | 合金元素添加對3D IC封裝中微接點之界面反應研究 Study of Alloy Constituent Additions on the Interfacial Reactions with Low Solder Volume for 3D IC Integration | Ting-Li Yang; 楊挺立 | 材料科學與工程學研究所 |
2010 | 局部溫度控制下電遷移對覆晶封裝中UBM消耗及其失效機制研究 Study of UBM Consumption in Flip Chip Solder Joints with Local Temperature Control | Ting-Li Yang; 楊挺立 | 材料科學與工程學研究所 |